Intersil CD40108BFMSR Mfr Package Description: FRIT SEALED, DIP-24 Technology: CMOS Package Shape: RECTANGULAR Package Style: IN-LINE Terminal Form: THROUGH-HOLE Terminal Pitch: 2.54 mm Terminal Finish: TIN LEAD Terminal Position: DUAL Number of Functions: 1 Number of Terminals: 24 Package Body Material: CERAMIC, GLASS-SEALED Temperature Grade: MILITARY Memory Width: 4 Organization: 4 X 4 Memory Density: 16 deg Operating Mode: SYNCHRONOUS Number of Words: 4 words Number of Words Code: 4 Operating Temperature-Max: 125 Cel Operating Temperature-Min: -55 Cel Supply Voltage-Nom (Vsup): 5 V Memory IC Type: MULTI-PORT SRAM Parallel/Serial: PARALLEL Access Time-Max (tACC): 972 ns