Результаты поиска 117B

Найдено 802 результатов.

• CY7C1475V33-117BGXI
  Cypress Semiconductor —
• CY7C1475V33-117BGXC
  Cypress Semiconductor —
• CY7C1473V33-117BZXI
  Cypress Semiconductor —
• CY7C1473V33-117BZXC
  Cypress Semiconductor —
• CY7C1471V33-117BZXI
  Cypress Semiconductor —
• CY7C1471V33-117BZXC
  Cypress Semiconductor —
• CY7C1383CV25-117BZI
  Cypress Semiconductor — Cypress Semiconductor CY7C1383CV25-117BZI Mfr Package Description: 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 Technology: CMOS Package Shape: RECTANGULAR Package Style: GRID ARRAY, THIN PROFILE Surface Mount: Yes Terminal Form: BALL Terminal Pitch: 1 mm Terminal Finish: TIN LEAD Terminal Position: BOTTOM Number of Functions: 1 Number of Terminals: 165 Package Body Material: PLASTIC/EPOXY Temperature Grade: INDUSTRIAL Memory Width: 18 Organization: 1M X 18 Memory Density: 1.89E7 deg Operating Mode: SYNCHRONOUS Number of Words: 1.05E6 words Number of Words Code: 1M Operating Temperature-Max: 85 Cel Operating Temperature-Min: -40 Cel Supply Voltage-Max (Vsup): 2.62 V Supply Voltage-Min (Vsup): 2.38 V Supply Voltage-Nom (Vsup): 2.5 V Memory IC Type: CACHE SRAM Parallel/Serial: PARALLEL Access Time-Max (tACC): 7.5 ns
• CY7C1381DV25-117BGI
  Cypress Semiconductor — Cypress Semiconductor CY7C1381DV25-117BGI Mfr Package Description: 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 Package Shape: RECTANGULAR Package Style: GRID ARRAY Surface Mount: Yes Terminal Form: BALL Terminal Pitch: 1.27 mm Terminal Position: BOTTOM Number of Functions: 1 Number of Terminals: 119 Package Body Material: PLASTIC/EPOXY Temperature Grade: INDUSTRIAL Memory Width: 36 Organization: 512K X 36 Memory Density: 1.89E7 deg Operating Mode: SYNCHRONOUS Number of Words: 524288 words Number of Words Code: 512K Operating Temperature-Max: 85 Cel Operating Temperature-Min: -40 Cel Supply Voltage-Max (Vsup): 2.62 V Supply Voltage-Min (Vsup): 2.38 V Supply Voltage-Nom (Vsup): 2.5 V Memory IC Type: CACHE SRAM Parallel/Serial: PARALLEL Access Time-Max (tACC): 7.5 ns
• CY7C1373CV25-117BZI
  Cypress Semiconductor — Cypress Semiconductor CY7C1373CV25-117BZI Mfr Package Description: 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 Package Shape: RECTANGULAR Package Style: GRID ARRAY, THIN PROFILE Surface Mount: Yes Terminal Form: BALL Terminal Pitch: 1 mm Terminal Finish: TIN LEAD Terminal Position: BOTTOM Number of Functions: 1 Number of Terminals: 165 Package Body Material: PLASTIC/EPOXY Temperature Grade: INDUSTRIAL Memory Width: 18 Organization: 1M X 18 Memory Density: 1.89E7 deg Operating Mode: SYNCHRONOUS Number of Words: 1.05E6 words Number of Words Code: 1M Operating Temperature-Max: 85 Cel Operating Temperature-Min: -40 Cel Supply Voltage-Max (Vsup): 2.62 V Supply Voltage-Min (Vsup): 2.38 V Supply Voltage-Nom (Vsup): 2.5 V Memory IC Type: ZBT SRAM Parallel/Serial: PARALLEL Access Time-Max (tACC): 7.5 ns
• CY7C1371DV25-117BGI
  Cypress Semiconductor — Cypress Semiconductor CY7C1371DV25-117BGI Mfr Package Description: 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 Package Shape: RECTANGULAR Package Style: GRID ARRAY Surface Mount: Yes Terminal Form: BALL Terminal Pitch: 1.27 mm Terminal Position: BOTTOM Number of Functions: 1 Number of Terminals: 119 Package Body Material: PLASTIC/EPOXY Temperature Grade: INDUSTRIAL Memory Width: 36 Organization: 512K X 36 Memory Density: 1.89E7 deg Operating Mode: SYNCHRONOUS Number of Words: 524288 words Number of Words Code: 512K Operating Temperature-Max: 85 Cel Operating Temperature-Min: -40 Cel Supply Voltage-Max (Vsup): 2.62 V Supply Voltage-Min (Vsup): 2.38 V Supply Voltage-Nom (Vsup): 2.5 V Memory IC Type: ZBT SRAM Parallel/Serial: PARALLEL Access Time-Max (tACC): 7.5 ns