Результаты поиска 5425-2

Найдено 55 результатов.

  • IDT (Integrated Device Technology) — IDT (Integrated Device Technology) 72T54252L6-7BB Mfr Package Description: 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324 Technology: CMOS Package Shape: SQUARE Package Style: GRID ARRAY Surface Mount: Yes Terminal Form: BALL Terminal Pitch: 1 mm Terminal Finish: TIN LEAD Terminal Position: BOTTOM Number of Functions: 1 Number of Terminals: 324 Package Body Material: PLASTIC/EPOXY Temperature Grade: COMMERCIAL Memory Width: 20 Organization: 64K X 20 Memory Density: 1.31E6 deg Operating Mode: SYNCHRONOUS Number of Words: 65536 words Number of Words Code: 64K Operating Temperature-Max: 70 Cel Operating Temperature-Min: 0.0 Cel Supply Voltage-Max (Vsup): 2.62 V Supply Voltage-Min (Vsup): 2.38 V Supply Voltage-Nom (Vsup): 2.5 V Cycle Time: 6.7 ns Output Enable: Yes Memory IC Type: OTHER FIFO Access Time-Max (tACC): 3.8 ns
  • FCI Semiconductor —
  • FCI — CONN SODIMM
  • IDT, Integrated Device Technology Inc —
  • IDT (Integrated Device Technology) —
  • FCI Semiconductor —
  • FCI Semiconductor — FCI Semiconductor 10033854-252FSLF Body Orientation: Right Angle Contact Material: Copper Alloy Contact Plating: Gold Current Rating: 0.5 A Gender: SKT Grid Size: Not Required Insulation Material: Liquid Crystl Polymr Lead Free Status / Rohs Status: Lead free / RoHS Compliant Mounting Style: Surface Mount Number Of Contact Rows: 2 Number Of Contacts: 200POS Number Of Positions / Contacts: 200 Pitch: 0.6 mm Pitch (mm): 0.6mm Product Depth (mm): 25.2mm Product Height (mm): 5.2mm Product Length (mm): 72.2mm Product Type: SODIMM Type: SO DIMM Socket Voltage Rating: 50 V
  • FCI Semiconductor —
  • FCI (Fluid Components International) —
  • TE Connectivity Aerospace, Defense and Marine — BOOT MOLDED




Электрофорум - Темы электроснабжение, защита, заземление, автоматика, электроника и другое.
Темы электроснабжение, защита, заземление, автоматика, электроника и другое.