Результаты поиска 31890

Найдено 56 результатов.

  • TE Connectivity — TE Connectivity 1-5353189-0 Applies To: Printed Circuit Board Board-to-board Stack Height (mm [in]): 4.00 [0.157], 6.00 [0.236], 7.00 [0.276], 8.00 [0.315], 12.00 [0.472] Centerline (mm [in]): 0.60 [0.024] Connector Style: Receptacle Contact Base Material: Copper Alloy Contact Layout: In-Line Contact Plating, Mating Area, Material: Gold (8) Family Name: Free Height Industry Application: Standard Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Locating Post(s): With Number Of Positions: 140 Packaging Method: Tape & Reel Pcb Mounting Orientation: Vertical Preloaded: Yes Product Type: Connector Region: Americas Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant
  • TE Connectivity — TE Connectivity 1-5353189-0 Applies To: Printed Circuit Board Board-to-board Stack Height (mm [in]): 4.00 [0.157], 6.00 [0.236], 7.00 [0.276], 8.00 [0.315], 12.00 [0.472] Centerline (mm [in]): 0.60 [0.024] Connector Style: Receptacle Contact Base Material: Copper Alloy Contact Layout: In-Line Contact Plating, Mating Area, Material: Gold (8) Family Name: Free Height Industry Application: Standard Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Locating Post(s): With Number Of Positions: 140 Packaging Method: Tape & Reel Pcb Mounting Orientation: Vertical Preloaded: Yes Product Type: Connector Region: Americas Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant
  • TE Connectivity — TE Connectivity 6-5353189-0 Applies To: Printed Circuit Board Board-to-board Stack Height (mm [in]): 4.00 [0.157] Centerline (mm [in]): 0.60 [0.024] Connector Style: Receptacle Contact Base Material: Copper Alloy Contact Layout: In-Line Contact Plating, Mating Area, Material: Gold (8) Family Name: Free Height Industry Application: Standard Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Locating Post(s): With Number Of Positions: 140 Packaging Method: Tape & Reel Pcb Mounting Orientation: Vertical Preloaded: Yes Product Type: Connector Region: Americas Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Sealant: With
  • TE Connectivity — TE Connectivity 6-5353189-0 Applies To: Printed Circuit Board Board-to-board Stack Height (mm [in]): 4.00 [0.157] Centerline (mm [in]): 0.60 [0.024] Connector Style: Receptacle Contact Base Material: Copper Alloy Contact Layout: In-Line Contact Plating, Mating Area, Material: Gold (8) Family Name: Free Height Industry Application: Standard Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Locating Post(s): With Number Of Positions: 140 Packaging Method: Tape & Reel Pcb Mounting Orientation: Vertical Preloaded: Yes Product Type: Connector Region: Americas Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Sealant: With
  • TE Connectivity — TE Connectivity 8-5353189-0 Applies To: Printed Circuit Board Board-to-board Stack Height (mm [in]): 4.00 [0.157] Centerline (mm [in]): 0.60 [0.024] Connector Style: Receptacle Contact Base Material: Copper Alloy Contact Layout: In-Line Contact Plating, Mating Area, Material: Gold (8) Family Name: Free Height Industry Application: Standard Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Locating Post(s): With Number Of Positions: 140 Packaging Method: Tape & Reel Pcb Mounting Orientation: Vertical Preloaded: Yes Product Type: Connector Region: Americas Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Sealant: With
  • TE Connectivity — TE Connectivity 8-5353189-0 Applies To: Printed Circuit Board Board-to-board Stack Height (mm [in]): 4.00 [0.157] Centerline (mm [in]): 0.60 [0.024] Connector Style: Receptacle Contact Base Material: Copper Alloy Contact Layout: In-Line Contact Plating, Mating Area, Material: Gold (8) Family Name: Free Height Industry Application: Standard Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Locating Post(s): With Number Of Positions: 140 Packaging Method: Tape & Reel Pcb Mounting Orientation: Vertical Preloaded: Yes Product Type: Connector Region: Americas Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Sealant: With
  • Tyco Electronics — Tyco Electronics 0-0031890-0 Connector Type: Ring Contact Material: Copper Contact Plating: Tin Insulator: RoHS Compliant Insulator Colour: Red Series: PIDG Stud/tab Size: 8mm Termination Method: Crimp Wire Size Range (awg): 22-16
  • TE Connectivity Raychem Cable Protection — CABLE STRANDED
  • FCI — HEADER BERGSTIK
  • FCI — HEADER BERGSTIK