Результаты поиска 12013
Найдено 679 результатов.
- SIPAT (Sichan Institute of Piezoelectric and Acoustooptic Technology) —
- SIPAT (Sichan Institute of Piezoelectric and Acous —
- Motorola Semiconductor — Motorola Semiconductor MC12013L Date_code: 04+ Quantity: 200
- Motorola Semiconductor —
- Microchip Technology —
- TE Connectivity — TE Connectivity 212013-2 Applies To: Wire/Cable Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (30) Contact Size: 8 Contact Style: Power Contact Type: Pin Density: Standard Government/industry Qualification: No High Current: No Lead Free Solder Processes: Wave solder capable to 240В°C, Wave solder capable to 260В°C, Wave solder capable to 265В°C Nasa Qualification: No Packaging Method: Loose Piece Product Series: 109 Product Type: Contact Retention Clip Material: Beryllium Copper Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Termination Method To Wire/cable: Crimp Wire Range (mm [awg]): 0.80-1.40ВІ [18-16]
- Wearnes Cambion —
- Wearnes Cambion —
- Wearnes Cambion —
- Wearnes Cambion —