Результаты поиска 46971
Найдено 115 результатов.
- Tyco Electronics —
- TE Connectivity — TE Connectivity 1746971-1 Applies To: Wire/Cable Centerline, Matrix (mm [in]): 6.20 [.244] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Pre-Tin Contact Type: Socket Current Rating (a): 7 Lead Free Solder Processes: Not relevant for lead free process Mating Alignment: Without Packaging Method: Strip Product Type: Contact Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Voltage (vac): 300 Wire Insulation Diameter (mm [in]): 2.00 ?€“ 3.75 [0.079 ?€“ 0.148] Wire Range (mm [awg]): 1.00-2.50?? [17-13]
- TE Connectivity — TE Connectivity 1746971-1 Applies To: Wire/Cable Centerline, Matrix (mm [in]): 6.20 [.244] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Pre-Tin Contact Type: Socket Current Rating (a): 7 Lead Free Solder Processes: Not relevant for lead free process Mating Alignment: Without Packaging Method: Strip Product Type: Contact Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Voltage (vac): 300 Wire Insulation Diameter (mm [in]): 2.00 ?€“ 3.75 [0.079 ?€“ 0.148] Wire Range (mm [awg]): 1.00-2.50?? [17-13]
- MOLEX [Molex Electronics Ltd.] — 2.00 by 2.25mm (.079 by .089") Pitch 5-Row, 6-Row and 8-Row VHDM-HSD Module-to-Backplane Connector System
- MOLEX9 [Molex Electronics Ltd.] — 2.00mm (.079) Pitch 5-Row VHDM-HSD???„?? Backplane Header, Guide Pin Signal Module, Shield End Version, 40 Circuits, Pin Length 4.25mm (.167)
- MOLEX9 [Molex Electronics Ltd.] — 2.00mm (.079") Pitch 5-Row VHDM-HSD Backplane Header, Guide Pin Signal Module
- MOLEX —
- MOLEX —
- MOLEX —
- MOLEX —