Результаты поиска LE600

Найдено 62 результатов.

• AGLE600V5-FG256Y
  Microsemi Corporation — Microsemi Corporation AGLE600V5-FG256Y Terminal Finish: TIN LEAD Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
• AGLE600V2-FFG256
  Microsemi Corporation — Microsemi Corporation AGLE600V2-FFG256 Mfr Package Description: 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH. FBGA-256 Technology: CMOS Package Shape: SQUARE Package Style: GRID ARRAY Surface Mount: Yes Terminal Form: BALL Terminal Pitch: 1 mm Terminal Finish: TIN LEAD SILVER Terminal Position: BOTTOM Number of Functions: 1 Number of Terminals: 256 Package Body Material: PLASTIC/EPOXY Temperature Grade: COMMERCIAL Organization: 600000 GATES Operating Temperature-Max: 70 Cel Operating Temperature-Min: 0.0 Cel Supply Voltage-Max (Vsup): 1.58 V Supply Voltage-Min (Vsup): 1.14 V Supply Voltage-Nom (Vsup): 1.2 V Clock Freq-Max (fclk): 250 MHz Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY Number of Equivalent Gates: 600000
• ALE600V5-F896YES
  Actel —
• ALE600V5-F896YPP
  Actel —
• ALE600V2-F896YES
  Actel —
• ALE600V2-F896YPP
  Actel —
• AGLE600V5-FG256I
  Microsemi SoC — IC FPGA 165 I/O 256FBGA
• AGLE600V2-FG256I
  Microsemi SoC — IC FPGA 165 I/O 256FBGA
• AGLE600V5-FG484I
  Microsemi SoC — IC FPGA 270 I/O 484FBGA
• AGLE600V2-FG484I
  Microsemi SoC — IC FPGA 270 I/O 484FBGA