Результаты поиска 3479
Найдено 474 результатов.
- TE Connectivity — TE Connectivity 2-1734797-4 Centerline (mm [in]): 1.00 [0.039] Circuit Identification Feature: Without Contact Current Rating, Max (a): 0.5 Contact Design: Single Beam Contact Mating Location: Top Contact Plating, Mating Area, Material: Matte Tin Contact Plating, Mating Area, Thickness (Вµm [Ојin]): 2.54 [100] Contact Transmits (typical Application): Signal (Data) Flex Cable Thickness (mm [in]): 0.3 [0.012] Housing Color: Black Housing Material: PA9T Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Length (x-axis) (mm [in]): 29.31 [1.1539] Number Of Positions: 24 Operating Temperature (В°c [В°f]): -25 – +85 [-13 – +185] Operating Voltage (vac): 50 Operating Voltage Reference: AC Packaging Method: Tape & Reel Pcb Mount Alignment: Without Pcb Mount Retention: With Pcb Mount Retention Type: Solder Pads Pcb Mounting Orientation: Right Angle Pick And Place Cover: Without Profile Height (y-axis) (mm [in]): 3.20 [0.126] Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Sealed: No Selectively Loaded: No Shielded: No Shrouded: Yes Strain Relief: Without Tail Orientation: In-line Tail Plating Material: Matte Tin Tail Plating, Thickness (Вµm [Ојin]): 2.54 [100] Termination Method To Pc Board: Surface Mount Width (z-axis) (mm [in]): 6.80 [0.268] Zif/non-zif: Non-ZIF
- TE Connectivity — TE Connectivity 2-1734797-5 Centerline (mm [in]): 1.00 [0.039] Circuit Identification Feature: Without Contact Current Rating, Max (a): 0.5 Contact Design: Single Beam Contact Mating Location: Top Contact Plating, Mating Area, Material: Matte Tin Contact Plating, Mating Area, Thickness (Вµm [Ојin]): 2.54 [100] Contact Transmits (typical Application): Signal (Data) Flex Cable Thickness (mm [in]): 0.3 [0.012] Housing Color: Black Housing Material: PA9T Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Length (x-axis) (mm [in]): 30.31 [1.1933] Number Of Positions: 25 Operating Temperature (В°c [В°f]): -25 – +85 [-13 – +185] Operating Voltage (vac): 50 Operating Voltage Reference: AC Packaging Method: Tape & Reel Pcb Mount Alignment: Without Pcb Mount Retention: With Pcb Mount Retention Type: Solder Pads Pcb Mounting Orientation: Right Angle Pick And Place Cover: Without Profile Height (y-axis) (mm [in]): 3.20 [0.126] Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Sealed: No Selectively Loaded: No Shielded: No Shrouded: Yes Strain Relief: Without Tail Orientation: In-line Tail Plating Material: Matte Tin Tail Plating, Thickness (Вµm [Ојin]): 2.54 [100] Termination Method To Pc Board: Surface Mount Width (z-axis) (mm [in]): 6.80 [0.268] Zif/non-zif: Non-ZIF
- TE Connectivity — TE Connectivity 2-1734797-6 Centerline (mm [in]): 1.00 [0.039] Circuit Identification Feature: Without Contact Current Rating, Max (a): 0.5 Contact Design: Single Beam Contact Mating Location: Top Contact Plating, Mating Area, Material: Matte Tin Contact Plating, Mating Area, Thickness (Вµm [Ојin]): 2.54 [100] Contact Transmits (typical Application): Signal (Data) Flex Cable Thickness (mm [in]): 0.3 [0.012] Housing Color: Black Housing Material: PA9T Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Length (x-axis) (mm [in]): 31.31 [1.2327] Number Of Positions: 26 Operating Temperature (В°c [В°f]): -25 – +85 [-13 – +185] Operating Voltage (vac): 50 Operating Voltage Reference: AC Packaging Method: Tape & Reel Pcb Mount Alignment: Without Pcb Mount Retention: With Pcb Mount Retention Type: Solder Pads Pcb Mounting Orientation: Right Angle Pick And Place Cover: Without Profile Height (y-axis) (mm [in]): 3.20 [0.126] Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Sealed: No Selectively Loaded: No Shielded: No Shrouded: Yes Strain Relief: Without Tail Orientation: In-line Tail Plating Material: Matte Tin Tail Plating, Thickness (Вµm [Ојin]): 2.54 [100] Termination Method To Pc Board: Surface Mount Width (z-axis) (mm [in]): 6.80 [0.268] Zif/non-zif: Non-ZIF
- TE Connectivity — TE Connectivity 2-1734797-7 Centerline (mm [in]): 1.00 [0.039] Circuit Identification Feature: Without Contact Current Rating, Max (a): 0.5 Contact Design: Single Beam Contact Mating Location: Top Contact Plating, Mating Area, Material: Matte Tin Contact Plating, Mating Area, Thickness (Вµm [Ојin]): 2.54 [100] Contact Transmits (typical Application): Signal (Data) Flex Cable Thickness (mm [in]): 0.3 [0.012] Housing Color: Black Housing Material: PA9T Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Length (x-axis) (mm [in]): 32.31 [1.272] Number Of Positions: 27 Operating Temperature (В°c [В°f]): -25 – +85 [-13 – +185] Operating Voltage (vac): 50 Operating Voltage Reference: AC Packaging Method: Tape & Reel Pcb Mount Alignment: Without Pcb Mount Retention: With Pcb Mount Retention Type: Solder Pads Pcb Mounting Orientation: Right Angle Pick And Place Cover: Without Profile Height (y-axis) (mm [in]): 3.20 [0.126] Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Sealed: No Selectively Loaded: No Shielded: No Shrouded: Yes Strain Relief: Without Tail Orientation: In-line Tail Plating Material: Matte Tin Tail Plating, Thickness (Вµm [Ојin]): 2.54 [100] Termination Method To Pc Board: Surface Mount Width (z-axis) (mm [in]): 6.80 [0.268] Zif/non-zif: Non-ZIF
- TE Connectivity — TE Connectivity 2-1734797-8 Centerline (mm [in]): 1.00 [0.039] Circuit Identification Feature: Without Contact Current Rating, Max (a): 0.5 Contact Design: Single Beam Contact Mating Location: Top Contact Plating, Mating Area, Material: Matte Tin Contact Plating, Mating Area, Thickness (Вµm [Ојin]): 2.54 [100] Contact Transmits (typical Application): Signal (Data) Flex Cable Thickness (mm [in]): 0.3 [0.012] Housing Color: Black Housing Material: PA9T Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Length (x-axis) (mm [in]): 33.31 [1.3114] Number Of Positions: 28 Operating Temperature (В°c [В°f]): -25 – +85 [-13 – +185] Operating Voltage (vac): 50 Operating Voltage Reference: AC Packaging Method: Tape & Reel Pcb Mount Alignment: Without Pcb Mount Retention: With Pcb Mount Retention Type: Solder Pads Pcb Mounting Orientation: Right Angle Pick And Place Cover: Without Profile Height (y-axis) (mm [in]): 3.20 [0.126] Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Sealed: No Selectively Loaded: No Shielded: No Shrouded: Yes Strain Relief: Without Tail Orientation: In-line Tail Plating Material: Matte Tin Tail Plating, Thickness (Вµm [Ојin]): 2.54 [100] Termination Method To Pc Board: Surface Mount Width (z-axis) (mm [in]): 6.80 [0.268] Zif/non-zif: Non-ZIF
- TE Connectivity — TE Connectivity 2-1734797-9 Centerline (mm [in]): 1.00 [0.039] Circuit Identification Feature: Without Contact Current Rating, Max (a): 0.5 Contact Design: Single Beam Contact Mating Location: Top Contact Plating, Mating Area, Material: Matte Tin Contact Plating, Mating Area, Thickness (Вµm [Ојin]): 2.54 [100] Contact Transmits (typical Application): Signal (Data) Flex Cable Thickness (mm [in]): 0.3 [0.012] Housing Color: Black Housing Material: PA9T Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Length (x-axis) (mm [in]): 34.31 [1.3508] Number Of Positions: 29 Operating Temperature (В°c [В°f]): -25 – +85 [-13 – +185] Operating Voltage (vac): 50 Operating Voltage Reference: AC Packaging Method: Tape & Reel Pcb Mount Alignment: Without Pcb Mount Retention: With Pcb Mount Retention Type: Solder Pads Pcb Mounting Orientation: Right Angle Pick And Place Cover: Without Profile Height (y-axis) (mm [in]): 3.20 [0.126] Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Sealed: No Selectively Loaded: No Shielded: No Shrouded: Yes Strain Relief: Without Tail Orientation: In-line Tail Plating Material: Matte Tin Tail Plating, Thickness (Вµm [Ојin]): 2.54 [100] Termination Method To Pc Board: Surface Mount Width (z-axis) (mm [in]): 6.80 [0.268] Zif/non-zif: Non-ZIF
- TE Connectivity —
- TE Connectivity — TE Connectivity 3-1734796-0 Centerline (mm [in]): 1.00 [0.039] Circuit Identification Feature: With Contact Current Rating, Max (a): 0.5 Contact Design: Single Beam Contact Plating, Mating Area, Material: Matte Tin Contact Plating, Mating Area, Thickness (Вµm [Ојin]): 3 [118] Contact Transmits (typical Application): Signal (Data) Flex Cable Thickness (mm [in]): 0.3 [0.012] Housing Color: Black Housing Material: PA6T Lead Free Solder Processes: Wave solder capable to 240В°C, Wave solder capable to 260В°C, Wave solder capable to 265В°C Length (x-axis) (mm [in]): 33.00 [1.300] Number Of Positions: 30 Operating Temperature (В°c [В°f]): -25 – +85 [-13 – +185] Operating Voltage (vac): 50 Operating Voltage Reference: AC Packaging Method: Tube Pcb Mount Alignment: With Pcb Mount Retention: With Pcb Mount Retention Type: Kinked Solder Tails Pcb Mounting Orientation: Vertical Pcb Thickness, Recommended (mm [in]): 1.60 [0.063] Pick And Place Cover: Without Profile Height (y-axis) (mm [in]): 5.40 [0.213] Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Sealed: No Selectively Loaded: No Shielded: No Shrouded: Yes Strain Relief: Without Tail Length (mm [in]): 3.2 [0.126] Tail Orientation: Staggered Type A Tail Plating Material: Matte Tin Tail Plating, Thickness (Вµm [Ојin]): 3 [118.11] Termination Method To Pc Board: Through Hole Width (z-axis) (mm [in]): 3.00 [0.118] Zif/non-zif: Non-ZIF
- TE Connectivity — TE Connectivity 3-1734797-0 Centerline (mm [in]): 1.00 [0.039] Circuit Identification Feature: Without Contact Current Rating, Max (a): 0.5 Contact Design: Single Beam Contact Mating Location: Top Contact Plating, Mating Area, Material: Matte Tin Contact Plating, Mating Area, Thickness (Вµm [Ојin]): 2.54 [100] Contact Transmits (typical Application): Signal (Data) Flex Cable Thickness (mm [in]): 0.3 [0.012] Housing Color: Black Housing Material: PA9T Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Length (x-axis) (mm [in]): 35.31 [1.3902] Number Of Positions: 30 Operating Temperature (В°c [В°f]): -25 – +85 [-13 – +185] Operating Voltage (vac): 50 Operating Voltage Reference: AC Packaging Method: Tape & Reel Pcb Mount Alignment: Without Pcb Mount Retention: With Pcb Mount Retention Type: Solder Pads Pcb Mounting Orientation: Right Angle Pick And Place Cover: Without Profile Height (y-axis) (mm [in]): 3.20 [0.126] Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Sealed: No Selectively Loaded: No Shielded: No Shrouded: Yes Strain Relief: Without Tail Orientation: In-line Tail Plating Material: Matte Tin Tail Plating, Thickness (Вµm [Ојin]): 2.54 [100] Termination Method To Pc Board: Surface Mount Width (z-axis) (mm [in]): 6.80 [0.268] Zif/non-zif: Non-ZIF
- TI (Texas Instruments) — TI (Texas Instruments) 93479LMQBQR Mfr Package Description: LCC-28 Technology: TTL Package Shape: SQUARE Package Style: CHIP CARRIER Surface Mount: Yes Terminal Form: NO LEAD Terminal Pitch: 1.27 mm Terminal Position: QUAD Number of Functions: 1 Number of Terminals: 28 Package Body Material: CERAMIC, METAL-SEALED COFIRED Temperature Grade: MILITARY Memory Width: 9 Organization: 256 X 9 Memory Density: 2304 deg Operating Mode: ASYNCHRONOUS Number of Words: 256 words Number of Words Code: 256 Operating Temperature-Max: 125 Cel Operating Temperature-Min: -55 Cel Supply Voltage-Max (Vsup): 5.5 V Supply Voltage-Min (Vsup): 4.5 V Supply Voltage-Nom (Vsup): 5 V Memory IC Type: STANDARD SRAM Parallel/Serial: PARALLEL Access Time-Max (tACC): 60 ns