Результаты поиска SP-29
Найдено 202 результатов.
- Advanced Thermal Solutions Inc — HEATSINK 45X45X20MM R-TAB T766
- Advanced Thermal Solutions Inc — HEATSINK 40X40X30MM R-TAB T766
- Advanced Thermal Solutions Inc — HEATSINK 40X40X35MM R-TAB T412
- Advanced Thermal Solutions Inc — HEATSINK 40X40X35MM R-TAB T766
- Infineon Technologies —
- Infineon Technologies — Infineon Technologies BSP295L6327HTSA1 Mfr Package Description: GREEN, PLASTIC PACKAGE-4 Lead Free: Yes EU RoHS Compliant: Yes China RoHS Compliant: Yes Package Shape: RECTANGULAR Package Style: SMALL OUTLINE Surface Mount: Yes Terminal Form: GULL WING Terminal Finish: MATTE TIN Terminal Position: DUAL Number of Terminals: 4 Package Body Material: PLASTIC/EPOXY Configuration: SINGLE WITH BUILT-IN DIODE Case Connection: DRAIN Number of Elements: 1 Transistor Element Material: SILICON Power Dissipation Ambient-Max: 1.8 W Channel Type: N-CHANNEL FET Technology: METAL-OXIDE SEMICONDUCTOR Operating Mode: ENHANCEMENT Transistor Type: GENERAL PURPOSE POWER Drain Current-Max (ID): 1.8 A DS Breakdown Voltage-Min: 60 V Drain-source On Resistance-Max: 0.5000 ohm Pulsed Drain Current-Max (IDM): 7.2 A
- ITT [ITT Industries] — Cannon Rack & Panel Connectors
- ITT [ITT Industries] — Cannon Rack & Panel Connectors
- ITT [ITT Industries] — Cannon Rack & Panel Connectors
- Infineon Technologies — Infineon Technologies BSP296NH6327XTSA1 Transistor Polarity: N-Channel Drain-Source Breakdown Voltage: 100 V Gate-Source Breakdown Voltage: +/- 20 V Continuous Drain Current: 1.1 A Rds On: 0.7 Ohms Maximum Operating Temperature: + 150 C Mounting Style: SMD/SMT Package / Case: PG-SOT-223-4 Fall Time: 21.4 ns Forward Transconductance - Min: 0.6 S Gate Charge Qg: 13.8 nC Minimum Operating Temperature: - 55 C Power Dissipation: 1.79 W Rise Time: 7.9 ns Series: BSP296 Typical Turn-Off Delay Time: 37.4 ns Part # Aliases: SP001059330