Результаты поиска RSF12GB470R

Найдено 28 результатов.

• 2-2013287-3
  TE Connectivity — TE Connectivity 2-2013287-3 Application Type: DDR 3 SO-DIMM Boss: With Center Key (mm [in]): Offset Right Centerline (mm [in]): 0.60 [0.024] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (30) Dram Type: Double Data Rate (DDR) III Dram Voltage: 1.5 V Ejector Location: Both Ends Ejector Type: Locking Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Style: Cam-In Keying: Reverse Latch Material: Stainless Steel Latch Plating: Tin Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Module Orientation: Right Angle Number Of Keys: 1 Number Of Positions: 204 Number Of Rows: Dual Packaging Method: Emboss on Reel Pcb Mount Style: Surface Mount Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 8.20 [0.322] Socket Style: SO DIMM Socket Type: Memory Card Stack Height (mm [in]): 4.00 [0.157]
• 2-2013289-1
  TE Connectivity — TE Connectivity 2-2013289-1 RoHS: yes Product Type: SODIMM Pitch: 0.6 mm Number of Positions / Contacts: 204 Mounting Style: SMD/SMT Mounting Angle: Right Housing Material: Thermoplastic Contact Material: Copper Alloy Contact Plating: Gold Height: 5.2 mm
• 2-2013289-1
  TE Connectivity — TE Connectivity 2-2013289-1 RoHS: yes Product Type: SODIMM Pitch: 0.6 mm Number of Positions / Contacts: 204 Mounting Style: SMD/SMT Mounting Angle: Right Housing Material: Thermoplastic Contact Material: Copper Alloy Contact Plating: Gold Height: 5.2 mm
• 2-2013289-2
  TE Connectivity — TE Connectivity 2-2013289-2 Application Type: DDR 3 SO-DIMM Boss: With Center Key (mm [in]): Offset Left Centerline (mm [in]): 0.60 [0.024] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (6) Dram Type: Double Data Rate (DDR) III Dram Voltage: 1.5 V Ejector Location: Both Ends Ejector Type: Locking Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Style: Cam-In Keying: Standard Latch Material: Stainless Steel Latch Plating: Tin Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Module Orientation: Right Angle Number Of Keys: 1 Number Of Positions: 204 Number Of Rows: Dual Packaging Method: Emboss on Reel Pcb Mount Style: Surface Mount Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 8.20 [0.322] Socket Style: SO DIMM Socket Type: Memory Card Stack Height (mm [in]): 5.20 [0.205]
• 2-2013289-3
  TE Connectivity — TE Connectivity 2-2013289-3 Application Type: DDR 3 SO-DIMM Boss: With Center Key (mm [in]): Offset Left Centerline (mm [in]): 0.60 [0.024] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (30) Dram Type: Double Data Rate (DDR) III Dram Voltage: 1.5 V Ejector Location: Both Ends Ejector Type: Locking Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Style: Cam-In Keying: Standard Latch Material: Stainless Steel Latch Plating: Tin Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Module Orientation: Right Angle Number Of Keys: 1 Number Of Positions: 204 Number Of Rows: Dual Packaging Method: Emboss on Reel Pcb Mount Style: Surface Mount Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 8.20 [0.322] Socket Style: SO DIMM Socket Type: Memory Card Stack Height (mm [in]): 5.20 [0.205]
• 2-2013290-1
  TE Connectivity — TE Connectivity 2-2013290-1 Application Type: DDR 3 SO-DIMM Boss: With Center Key (mm [in]): Offset Right Centerline (mm [in]): 0.60 [0.024] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold Flash Dram Type: Double Data Rate (DDR) III Dram Voltage: 1.5 V Ejector Location: Both Ends Ejector Type: Locking Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Style: Cam-In Keying: Reverse Latch Material: Stainless Steel Latch Plating: Tin Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Module Orientation: Right Angle Number Of Keys: 1 Number Of Positions: 204 Number Of Rows: Dual Packaging Method: Emboss on Reel Pcb Mount Style: Surface Mount Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 8.20 [0.322] Socket Style: SO DIMM Socket Type: Memory Card Stack Height (mm [in]): 5.20 [0.205]
• 2-2013290-2
  TE Connectivity — TE Connectivity 2-2013290-2 Application Type: DDR 3 SO-DIMM Boss: With Center Key (mm [in]): Offset Right Centerline (mm [in]): 0.60 [0.024] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (6) Dram Type: Double Data Rate (DDR) III Dram Voltage: 1.5 V Ejector Location: Both Ends Ejector Type: Locking Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Style: Cam-In Keying: Reverse Latch Material: Stainless Steel Latch Plating: Tin Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Module Orientation: Right Angle Number Of Keys: 1 Number Of Positions: 204 Number Of Rows: Dual Packaging Method: Emboss on Reel Pcb Mount Style: Surface Mount Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 8.20 [0.322] Socket Style: SO DIMM Socket Type: Memory Card Stack Height (mm [in]): 5.20 [0.205]
• 2-2013290-3
  TE Connectivity — TE Connectivity 2-2013290-3 Application Type: DDR 3 SO-DIMM Boss: With Center Key (mm [in]): Offset Right Centerline (mm [in]): 0.60 [0.024] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (30) Dram Type: Double Data Rate (DDR) III Dram Voltage: 1.5 V Ejector Location: Both Ends Ejector Type: Locking Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Style: Cam-In Keying: Reverse Latch Material: Stainless Steel Latch Plating: Tin Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Module Orientation: Right Angle Number Of Keys: 1 Number Of Positions: 204 Number Of Rows: Dual Packaging Method: Emboss on Reel Pcb Mount Style: Surface Mount Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 8.20 [0.322] Socket Style: SO DIMM Socket Type: Memory Card Stack Height (mm [in]): 5.20 [0.205]
• 2-2013297-1
  TE Connectivity — TE Connectivity 2-2013297-1 Application Type: DDR 3 SO-DIMM Boss: With Center Key (mm [in]): Offset Left Centerline (mm [in]): 0.60 [0.024] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold Flash Dram Type: Double Data Rate (DDR) III Dram Voltage: 1.5 V Ejector Location: Both Ends Ejector Type: Locking Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Style: Cam-In Keying: Standard Latch Material: Stainless Steel Latch Plating: Tin Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Module Orientation: Right Angle Number Of Keys: 1 Number Of Positions: 204 Number Of Rows: Dual Packaging Method: Emboss on Reel Pcb Mount Style: Surface Mount Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 8.20 [0.322] Socket Style: SO DIMM Socket Type: Memory Card Stack Height (mm [in]): 8.00 [0.315]
• 2-2013297-2
  TE Connectivity — TE Connectivity 2-2013297-2 Application Type: DDR 3 SO-DIMM Boss: With Center Key (mm [in]): Offset Left Centerline (mm [in]): 0.60 [0.024] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (6) Dram Type: Double Data Rate (DDR) III Dram Voltage: 1.5 V Ejector Location: Both Ends Ejector Type: Locking Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Style: Cam-In Keying: Standard Latch Material: Stainless Steel Latch Plating: Tin Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Module Orientation: Right Angle Number Of Keys: 1 Number Of Positions: 204 Number Of Rows: Dual Packaging Method: Emboss on Reel Pcb Mount Style: Surface Mount Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 8.20 [0.322] Socket Style: SO DIMM Socket Type: Memory Card Stack Height (mm [in]): 8.00 [0.315]