Результаты поиска 74721

Найдено 19 результатов.

• 1747216-7
  TE Connectivity — TE Connectivity 1747216-7 Application: Production Assembly Process Feature: Pick and Place Cover, Plastic CAP Chip Compatibility: IntelВ® PentiumВ® 4 (mPGA479 pattern) Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold Contact Style: Stamped + Formed Cover Material: High Temperature Thermoplastic Frame Style: Open Grid Size: 26x26 Grid Spacing (mm [in]): 1.27 x 1.27 [.050 x .050] Heat Sink Attachment: With Heat Sink Style: Two Center Latches Housing Color: Black Housing Material: High Temperature Thermoplastic Housing Material Temperature: High Insertion Force: ZIF Lead Free Solder Processes: Reflow solder capable to 245В°C Leg Style: Ball Grid Array (BGA) Number Of Positions: 479 Packaging Method: Tape Mounted on Reel Packaging Quantity: 200 sockets/box Pcb Mount Style: Surface Mount Profile: Low Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Socket Identifier: None Socket Overall Height (mm [in]): 3.1 [0.122] Ul Flammability Rating: UL 94V-0 Zif Actuator: Screwdriver
• 1747216-7
  TE Connectivity — TE Connectivity 1747216-7 Application: Production Assembly Process Feature: Pick and Place Cover, Plastic CAP Chip Compatibility: IntelВ® PentiumВ® 4 (mPGA479 pattern) Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold Contact Style: Stamped + Formed Cover Material: High Temperature Thermoplastic Frame Style: Open Grid Size: 26x26 Grid Spacing (mm [in]): 1.27 x 1.27 [.050 x .050] Heat Sink Attachment: With Heat Sink Style: Two Center Latches Housing Color: Black Housing Material: High Temperature Thermoplastic Housing Material Temperature: High Insertion Force: ZIF Lead Free Solder Processes: Reflow solder capable to 245В°C Leg Style: Ball Grid Array (BGA) Number Of Positions: 479 Packaging Method: Tape Mounted on Reel Packaging Quantity: 200 sockets/box Pcb Mount Style: Surface Mount Profile: Low Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Socket Identifier: None Socket Overall Height (mm [in]): 3.1 [0.122] Ul Flammability Rating: UL 94V-0 Zif Actuator: Screwdriver
• 1747216-9
  TE Connectivity — TE Connectivity 1747216-9 Application: Production Assembly Process Feature: Pick and Place Cover, Plastic CAP Chip Compatibility: IntelВ® PentiumВ® 4 (mPGA479 pattern) Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold Contact Style: Stamped + Formed Cover Material: High Temperature Thermoplastic Frame Style: Open Grid Size: 26x26 Grid Spacing (mm [in]): 1.27 x 1.27 [.050 x .050] Heat Sink Attachment: With Heat Sink Style: Two Center Latches Housing Color: Black Housing Material: High Temperature Thermoplastic Housing Material Temperature: High Insertion Force: ZIF Lead Free Solder Processes: Reflow solder capable to 245В°C Leg Style: Ball Grid Array (BGA) Number Of Positions: 479 Packaging Method: Tape Mounted on Reel Packaging Quantity: 200 sockets/box Pcb Mount Style: Surface Mount Profile: Low Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Socket Identifier: None Socket Overall Height (mm [in]): 3.1 [0.122] Ul Flammability Rating: UL 94V-0 Zif Actuator: Screwdriver Other Names: 1747216-9
• 1747216-9
  TE Connectivity — TE Connectivity 1747216-9 Application: Production Assembly Process Feature: Pick and Place Cover, Plastic CAP Chip Compatibility: IntelВ® PentiumВ® 4 (mPGA479 pattern) Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold Contact Style: Stamped + Formed Cover Material: High Temperature Thermoplastic Frame Style: Open Grid Size: 26x26 Grid Spacing (mm [in]): 1.27 x 1.27 [.050 x .050] Heat Sink Attachment: With Heat Sink Style: Two Center Latches Housing Color: Black Housing Material: High Temperature Thermoplastic Housing Material Temperature: High Insertion Force: ZIF Lead Free Solder Processes: Reflow solder capable to 245В°C Leg Style: Ball Grid Array (BGA) Number Of Positions: 479 Packaging Method: Tape Mounted on Reel Packaging Quantity: 200 sockets/box Pcb Mount Style: Surface Mount Profile: Low Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Socket Identifier: None Socket Overall Height (mm [in]): 3.1 [0.122] Ul Flammability Rating: UL 94V-0 Zif Actuator: Screwdriver Other Names: 1747216-9
• 1747217-6
  TE Connectivity — TE Connectivity 1747217-6 Product Type: IC Socket RoHS Compliant: RoHS Compliant Socket Type: PGA Number of Contacts: 47
• 08-307472-10
  Aries — Correct-A-Chip IC Socket Adapters HB2E Relay w/ SM Type TXSS
• 5-867472-1
  TE Connectivity — TE Connectivity 5-867472-1 Boot: Without Connector Style: Receptacle Contact Base Material: Beryllium Copper Contact Plating, Mating Area, Material: Gold (30) Flange: With Housing Material: Polyester Lead Free Solder Processes: Not relevant for lead free process Lead Length (mm [in]): 304.80 [12.000] Mount Angle: Straight Mount Type: Panel Mount Number Of Positions: 6 Operating Voltage (kvdc): 6 Prewired: Yes Product Style: Assembly Product Type: Flying Lead Assembly Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Shape: Rectangular Shielded: No Wire Color: Black, Red, White, Green, Brown, Blue Wire Insulation: Fluoropolymer Wire Size (mmВІ [awg]): 0.2ВІ [24]
• 09474747211
  Harting — HA-VIS SMART PATCH CABLE CAT6 Y
• 08-307472-11
  Aries Electronics —