Результаты поиска 29240
Найдено 65 результатов.
- Multicomp — Multicomp SPC29240 Assembly Cable Type: Coaxial Cable Assembly Type: Coaxial Cable Length: 60" Connector Type A: 7-16 DIN Plug Connector Type B: SMA Plug Jacket Color: Black Jacket Material: Polyolefin Overall Length: 60" Rg Cable Type: RG142B Rohs Compliant: Yes
- Crouzet — Crouzet 82924030 No. Of Phases: 4 Ratio: 20 Svhc: No SVHC (18-Jun-2010) Torque Max: 0.5N-m
- Crouzet — Crouzet 82924030 No. Of Phases: 4 Ratio: 20 Svhc: No SVHC (18-Jun-2010) Torque Max: 0.5N-m
- TE Connectivity — TE Connectivity 292405-1 Card Guide Slots: With Card Insertion Style: Normal Insertion Card Stop: With Card Type: 2FF mini SIM Centerline (mm [in]): 2.54 [0.100] Connector Stabilization Ribs: Without Contact Base Material: Copper Alloy Ejector Type: Push - Pull Height Above Pc Board (mm [in]): 2.85 [0.112] Housing Material: Thermoplastic Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Number Of Contacts: 6 Packaging Method: Tape & Reel Packaging Quantity: 1,000/Reel Pcb Mount Style: Surface Mount Product Type: Connector Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant
- TE Connectivity — TE Connectivity 292405-1 Card Guide Slots: With Card Insertion Style: Normal Insertion Card Stop: With Card Type: 2FF mini SIM Centerline (mm [in]): 2.54 [0.100] Connector Stabilization Ribs: Without Contact Base Material: Copper Alloy Ejector Type: Push - Pull Height Above Pc Board (mm [in]): 2.85 [0.112] Housing Material: Thermoplastic Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Number Of Contacts: 6 Packaging Method: Tape & Reel Packaging Quantity: 1,000/Reel Pcb Mount Style: Surface Mount Product Type: Connector Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant
- TE Connectivity — TE Connectivity 292406-4 Application Type: DDR SDRAM Boss: With Center Key (mm [in]): Offset Left Centerline (mm [in]): 0.60 [0.024] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold Flash Dram Type: Double Data Rate (DDR), Double Data Rate (DDR) II Dram Voltage: 1.8 V Ejector Location: Both Ends Ejector Type: Locking Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Style: Cam-In Keying: Standard Latch Material: Stainless Steel Lead Free Solder Processes: Not reviewed for lead free solder process Module Orientation: Right Angle Mount Type: Printed Circuit Board Number Of Keys: 1 Number Of Positions: 200 Number Of Rows: Dual Packaging Method: Reel Packaging Quantity: 200 Pieces/Reel Pcb Mount Style: Surface Mount Profile: Standard Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 5.80 [0.228] Socket Style: SO DIMM Socket Type: Memory Card Solder Tail Contact Plating: Gold Flash Stack Height (mm [in]): 4.00 [0.157] Ul Flammability Rating: UL 94V-0
- TE Connectivity — TE Connectivity 292406-5 Application Type: DDR SDRAM Boss: With Center Key (mm [in]): Offset Left Centerline (mm [in]): 0.60 [0.024] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (10) Dram Type: Double Data Rate (DDR), Double Data Rate (DDR) II Dram Voltage: 1.8 V Ejector Location: Both Ends Ejector Type: Locking Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Style: Cam-In Keying: Standard Latch Material: Stainless Steel Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Module Orientation: Right Angle Mount Type: Printed Circuit Board Number Of Keys: 1 Number Of Positions: 200 Number Of Rows: Dual Packaging Method: Reel Packaging Quantity: 200 Pieces/Reel Pcb Mount Style: Surface Mount Profile: Standard Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 5.80 [0.228] Socket Style: SO DIMM Socket Type: Memory Card Solder Tail Contact Plating: Gold Flash Stack Height (mm [in]): 4.00 [0.157] Ul Flammability Rating: UL 94V-0
- TE Connectivity — TE Connectivity 292407-4 Application Type: DDR SDRAM Boss: With Center Key (mm [in]): Offset Right Centerline (mm [in]): 0.60 [0.024] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold Flash Dram Type: Double Data Rate (DDR), Double Data Rate (DDR) II Dram Voltage: 1.8 V Ejector Location: Both Ends Ejector Type: Locking Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Style: Cam-In Keying: Reverse Latch Material: Stainless Steel Lead Free Solder Processes: Not reviewed for lead free solder process Module Orientation: Right Angle Mount Type: Printed Circuit Board Number Of Keys: 1 Number Of Positions: 200 Number Of Rows: Dual Packaging Method: Reel Packaging Quantity: 200 Pieces/Reel Pcb Mount Style: Surface Mount Profile: Standard Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 5.80 [0.228] Socket Style: SO DIMM Socket Type: Memory Card Solder Tail Contact Plating: Gold Flash Stack Height (mm [in]): 4.00 [0.157] Ul Flammability Rating: UL 94V-0
- TE Connectivity — TE Connectivity 292407-5 Application Type: DDR SDRAM Boss: With Center Key (mm [in]): Offset Right Centerline (mm [in]): 0.60 [0.024] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (10) Dram Type: Double Data Rate (DDR), Double Data Rate (DDR) II Dram Voltage: 1.8 V Ejector Location: Both Ends Ejector Type: Locking Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Style: Cam-In Keying: Reverse Latch Material: Stainless Steel Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Module Orientation: Right Angle Mount Type: Printed Circuit Board Number Of Keys: 1 Number Of Positions: 200 Number Of Rows: Dual Packaging Method: Reel Packaging Quantity: 200 Pieces/Reel Pcb Mount Style: Surface Mount Profile: Standard Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 5.80 [0.228] Socket Style: SO DIMM Socket Type: Memory Card Solder Tail Contact Plating: Gold Flash Stack Height (mm [in]): 4.00 [0.157] Ul Flammability Rating: UL 94V-0
- Xicon — 1/10W 1% 0805 Chip Resistors 1/10WATT 40.2KOHMS