Результаты поиска 34160
Найдено 158 результатов.
- MICROSEMI [Microsemi Corporation] — Silicon Power Rectifier Assemblies Plate Heatsink
- MICROSEMI [Microsemi Corporation] — Silicon Power Rectifier Assemblies Plate Heatsink
- MICROSEMI [Microsemi Corporation] — Silicon Power Rectifier Assemblies Plate Heatsink
- MICROSEMI [Microsemi Corporation] — Silicon Power Rectifier Assemblies Plate Heatsink
- MICROSEMI [Microsemi Corporation] — Silicon Power Rectifier Assemblies Plate Heatsink
- MICROSEMI [Microsemi Corporation] — Silicon Power Rectifier Assemblies Plate Heatsink
- OST (On-Shore Technology) — OST (On-Shore Technology) OSTYK33416030 Barrier Type: 3 Wall (Tri) Bottom Termination: Quick Connect (0.250") Color: Black Current: 20A Features: - Material - Insulation: Polyamide (PA66), Nylon 6/6 Material Flammability Rating: UL94 V-0 Mounting Type: Through Hole Number Of Circuits: 16 Number Of Positions: 16 Number Of Rows: 1 Operating Temperature: -40В°C ~ 105В°C Pitch: 0.325" (8.255mm) Series: OSTYK33 Terminal Block Type: Barrier Block Top Termination: Screws with Captive Plate Voltage: 300V Wire Gauge: 12-22 AWG
- Aavid Thermalloy — Aavid Thermalloy 341600F00000G Color: Black Designed For: BGA, PGA, QFP Dimensions: 50.8 mm L x 12.7 mm W x 0.33 mm H Heatsink Material: Copper Lead Free Status / Rohs Status: Lead free / RoHS Compliant Mounting Style: Adhesive Product: Heatsinks
- 3M — 3M 3416-0000S/EC Approval Bodies: UL, CSA Connector Type: DIP Contact Material: Beryllium Copper Contact Plating: Tin Contact Termination: IDC Gender: Plug No. Of Contacts: 16 No. Of Rows: 2 Pitch Spacing: 2.54mm Rohs Compliant: Yes Series: 3400
- 3M — 3M 3416-0000S/EC Approval Bodies: UL, CSA Connector Type: DIP Contact Material: Beryllium Copper Contact Plating: Tin Contact Termination: IDC Gender: Plug No. Of Contacts: 16 No. Of Rows: 2 Pitch Spacing: 2.54mm Rohs Compliant: Yes Series: 3400