Результаты поиска RSF12GB470R

Найдено 28 результатов.

• 22-01-3217
  MOLEX2 [Molex Electronics Ltd.] — 2.54mm (.100) Pitch KK® Crimp Terminal Housing, Friction Ramp, 21 Circuits, Use with 2759|6459|41572
• 22-01-3227
  MOLEX2 [Molex Electronics Ltd.] — 2.54mm (.100) Pitch KK® Crimp Terminal Housing, Friction Ramp, 22 Circuits, Use with 2759|6459|41572
• 22-01-3247
  MOLEX2 [Molex Electronics Ltd.] — 2.54mm (.100) Pitch KK® Crimp Terminal Housing, Friction Ramp, 24 Circuits, Use with 2759|6459|41572
• 22-01-3257
  MOLEX2 [Molex Electronics Ltd.] — 2.54mm (.100) Pitch KK® Crimp Terminal Housing, Friction Ramp, 25 Circuits, Use with 2759|6459|41572
• 22-01-3267
  MOLEX2 [Molex Electronics Ltd.] — 2.54mm (.100) Pitch KK® Crimp Terminal Housing, Friction Ramp, 26 Circuits
• 22-01-3207
  MOLEX — MOLEX 22-01-3207 Body Material: PA Polyamide (Nylon) Color: White Connector Type: Wire To Board Gender: Receptacle No. Of Contacts: 20 No. Of Rows: 1 Pitch Spacing: 2.54mm Series: KK
• 2-2013266-6
  TE Connectivity — TE Connectivity 2-2013266-6 Application Type: DDR III Center Key (mm [in]): Offset Left Center Post: Without Centerline (mm [in]): 1.00 [0.039] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (30) Dram Type: Double Data Rate (DDR) III Dram Voltage: 1.5 V Ejector Location: Both Ends Ejector Material Color: Amber Ejector Type: Standard Housing Color: Black Housing Material: High Temperature Nylon Insertion Style: Direct Insert Keying: Standard Lead Free Solder Processes: Not reviewed for lead free solder process Module Orientation: Vertical Mount Type: Printed Circuit Board Number Of Keys: 1 Number Of Positions: 240 Number Of Rows: Dual Packaging Method: Tray Pcb Mount Style: Through Hole Retention Post(s) Location: Both Ends Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 1.90 [0.075] Socket Style: DIMM Socket Type: Memory Card Solder Tail Contact Plating: Tin-Lead (100) over Nickel (50) Termination Post Length (mm [in]): 2.40 [0.094] Ul Flammability Rating: UL 94V-0
• 2-2013266-7
  TE Connectivity — TE Connectivity 2-2013266-7 Application Type: DDR III Center Key (mm [in]): Offset Left Center Post: Without Centerline (mm [in]): 1.00 [0.039] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (30) Dram Type: Double Data Rate (DDR) III Dram Voltage: 1.5 V Ejector Location: Both Ends Ejector Material Color: Natural Ejector Type: Standard Housing Color: Natural Housing Material: High Temperature Nylon Insertion Style: Direct Insert Keying: Standard Lead Free Solder Processes: Not reviewed for lead free solder process Module Orientation: Vertical Mount Type: Printed Circuit Board Number Of Keys: 1 Number Of Positions: 240 Number Of Rows: Dual Packaging Method: Tray Pcb Mount Style: Through Hole Retention Post(s) Location: Both Ends Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 1.90 [0.075] Socket Style: DIMM Socket Type: Memory Card Solder Tail Contact Plating: Tin-Lead (100) over Nickel (50) Termination Post Length (mm [in]): 3.30 [0.130] Ul Flammability Rating: UL 94V-0
• 2-2013287-1
  TE Connectivity — TE Connectivity 2-2013287-1 Application Type: DDR 3 SO-DIMM Boss: With Center Key (mm [in]): Offset Right Centerline (mm [in]): 0.60 [0.024] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold Flash Dram Type: Double Data Rate (DDR) III Dram Voltage: 1.5 V Ejector Location: Both Ends Ejector Type: Locking Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Style: Cam-In Keying: Reverse Latch Material: Stainless Steel Latch Plating: Tin Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Module Orientation: Right Angle Number Of Keys: 1 Number Of Positions: 204 Number Of Rows: Dual Packaging Method: Emboss on Reel Pcb Mount Style: Surface Mount Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 8.20 [0.322] Socket Style: SO DIMM Socket Type: Memory Card Stack Height (mm [in]): 4.00 [0.157]
• 2-2013287-2
  TE Connectivity — TE Connectivity 2-2013287-2 Application Type: DDR 3 SO-DIMM Boss: With Center Key (mm [in]): Offset Right Centerline (mm [in]): 0.60 [0.024] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (6) Dram Type: Double Data Rate (DDR) III Dram Voltage: 1.5 V Ejector Location: Both Ends Ejector Type: Locking Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Style: Cam-In Keying: Reverse Latch Material: Stainless Steel Latch Plating: Tin Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Module Orientation: Right Angle Number Of Keys: 1 Number Of Positions: 204 Number Of Rows: Dual Packaging Method: Emboss on Reel Pcb Mount Style: Surface Mount Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 8.20 [0.322] Socket Style: SO DIMM Socket Type: Memory Card Stack Height (mm [in]): 4.00 [0.157]