Результаты поиска 3501MX

Найдено 1 результатов.

• 5962-9323501MXX
  Intel Corporation — Intel Corporation 5962-9323501MXX Mfr Package Description: CERAMIC, DIP-32 Technology: CMOS Package Shape: RECTANGULAR Package Style: IN-LINE Terminal Form: THROUGH-HOLE Terminal Position: DUAL Number of Functions: 1 Number of Terminals: 32 Package Body Material: CERAMIC, GLASS-SEALED Temperature Grade: MILITARY Memory Width: 8 Organization: 256K X 8 Memory Density: 2.10E6 deg Operating Mode: ASYNCHRONOUS Number of Words: 262144 words Number of Words Code: 256K Operating Temperature-Max: 125 Cel Operating Temperature-Min: -55 Cel Supply Voltage-Max (Vsup): 5.5 V Supply Voltage-Min (Vsup): 4.5 V Supply Voltage-Nom (Vsup): 5 V Memory IC Type: EEPROM 5V Parallel/Serial: PARALLEL Access Time-Max (tACC): 200 ns