Результаты поиска 42013

Найдено 104 результатов.

• 42013000000
  Littelfuse / Wickmann Brand — FUSE T-LAG 3.00A 125V UL 6125SMD
• 105142-0132
  MOLEX — MOLEX 105142-0132 RoHS: yes Product: LGA Sockets Pitch: 1.02 mm Number of Positions / Contacts: 2011 Contact Plating: Gold Mounting Style: SMD/SMT Termination Style: Solder Socket / Case Type: LGA 2011 Operating Temperature Range: - 40 C to + 100 C Contact Material: Copper Alloy Current Rating: 0.5 A Flammability Rating: UL94V-0 Housing Material: Thermoplastic Insulation Resistance: 800 MOhms Length: 58.5 mm Series: 105142 Voltage Rating: 5 V Width: 51 mm
• 4-2013620-3
  TE Connectivity — TE Connectivity 4-2013620-3 Application: Production Assembly Process Feature: Pick and Place Cover, Tape Chip Compatibility: IntelВ® Coreв„ў i7 989 Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (15) Contact Style: Stamped + Formed Cover Color: Black Cover Material: High Temperature Thermoplastic Frame Style: Open Grid Size: 35x36 Grid Spacing (mm [in]): 1.00 x 1.00 [.039 x .039] Heat Sink Attachment: Without Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Force: ZIF Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Leg Style: Ball Grid Array (BGA) Number Of Positions: 989 Packaging Method: Tape Mounted on Reel Packaging Quantity: 120 Pcb Mount Style: Surface Mount Profile: Low Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Socket Identifier: rPGA989 Ul Flammability Rating: UL 94V-0 Zif Actuator: Screwdriver/Cam
• 4-2013620-4
  TE Connectivity — TE Connectivity 4-2013620-4 Application: Production Assembly Process Feature: Pick and Place Cover, Tape Chip Compatibility: IntelВ® Coreв„ў rPGA988A Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (15) Contact Style: Stamped + Formed Cover Color: Black Cover Material: High Temperature Thermoplastic Frame Style: Open Grid Size: 35x36 Grid Spacing (mm [in]): 1.00 x 1.00 [.039 x .039] Heat Sink Attachment: Without Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Force: ZIF Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Leg Style: Ball Grid Array (BGA) Number Of Positions: 988 Packaging Method: Tape Mounted on Reel Packaging Quantity: 120 Pcb Mount Style: Surface Mount Profile: Low Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Socket Identifier: rPGA989 Ul Flammability Rating: UL 94V-0 Zif Actuator: Screwdriver/Cam
• 4-2013620-5
  TE Connectivity — TE Connectivity 4-2013620-5 Application: Production Assembly Process Feature: Pick and Place Cover, Tape Chip Compatibility: IntelВ® Coreв„ў rPGA988B Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (15) Contact Style: Stamped + Formed Cover Color: Black Cover Material: High Temperature Thermoplastic Frame Style: Open Grid Size: 35x36 Grid Spacing (mm [in]): 1.00 x 1.00 [.039 x .039] Heat Sink Attachment: Without Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Force: ZIF Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Leg Style: Ball Grid Array (BGA) Number Of Positions: 988 Packaging Method: Tape Mounted on Reel Packaging Quantity: 120 Pcb Mount Style: Surface Mount Profile: Low Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Socket Identifier: rPGA988B Ul Flammability Rating: UL 94V-0 Zif Actuator: Screwdriver/Cam
• 60-42013-5P
  Amphenol Industrial Operations — CONN PLUG W/PINS
• 09693420133
  Harting — D SUB 13W3 FE CRIMP_S4_4-40 UNC
• T38420-13-0
  Curtis Industries — Connector Barrier Block Strip 13 Circuit 0.375" (9.53mm)
• 929842-01-32-RA
  3M —
• 929842-01-36-RA
  3M —