Результаты поиска 8317

Найдено 560 результатов.

• ZB5AW831723
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• ZB4BW831723
  Square D —
• 831742AGILF
  IDT (Integrated Device Technology) — IDT (Integrated Device Technology) 831742AGILF Mfr Package Description: 4.40 X 7.80 MM, 0.925 MM HEIGHT, ROHS COMPLIANT, MO-153, TSSOP-24 Lead Free: Yes EU RoHS Compliant: Yes Package Shape: RECTANGULAR Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Surface Mount: Yes Terminal Form: GULL WING Terminal Pitch: 0.6500 mm Terminal Finish: MATTE TIN Terminal Position: DUAL Number of Functions: 1 Number of Terminals: 24 Package Body Material: PLASTIC/EPOXY Temperature Grade: INDUSTRIAL Output Characteristics: 3-ST Operating Temperature-Max: 85 Cel Operating Temperature-Min: -40 Cel Supply Voltage-Max (Vsup): 3.6 V Supply Voltage-Min (Vsup): 3 V Supply Voltage-Nom (Vsup): 3.3 V Input Conditioning: DIFFERENTIAL MUX Logic IC Type: LOW SKEW CLOCK DRIVER Number of Inverted Outputs: 0.0 Number of True Outputs: 4 Propagation Delay (tpd): 2.5 ns Same Edge Skew-Max (tskwd): 0.0150 ns fmax-Min: 700 MHz
• 831724AKILF
  IDT (Integrated Device Technology) — IDT (Integrated Device Technology) 831724AKILF RoHS: yes Multiply / Divide Factor: 2 Output Type: HCSL Max Output Freq: 700 MHz Supply Voltage - Max: 3.6 V Supply Voltage - Min: 3 V Maximum Operating Temperature: + 85 C Package / Case: VFQFPN-32 Input Type: HCSL, HSTL, LVDS, LVPECL, SSTL Minimum Operating Temperature: - 40 C Mounting Style: SMD/SMT Supply Current: 700 Mb/s Type: Differential Clock, Data Multiplexer
• 5-5353831-7
  TE Connectivity — TE Connectivity 5-5353831-7 Applies To: Printed Circuit Board Board-to-board Stack Height (mm [in]): 7.00 [0.276] Centerline (mm [in]): 0.60 [0.024] Connector Style: Plug Contact Base Material: Copper Alloy Contact Layout: In-Line Contact Plating, Mating Area, Material: Gold (8) Family Name: Free Height Grounding Contact: With Grounding Plate: With Industry Application: Board-to-Board (Personal Systems/Computers), Mezzanine/Stacking (Multi-User), Networking (Communications) Keyed: Yes Lead Free Solder Processes: Reflow solder capable to 245?°C Locating Post(s): With Number Of Positions: 90 Packaging Method: Tape & Reel Pcb Mounting Orientation: Vertical Preloaded: Yes Product Type: Connector Region: Americas, Asia/Pacific Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Sealant: With
• w83176g-733
  Winbond Electronic —
• w83176g-735
  Winbond Electronic —
• W83176R-251
  Winbond Electronic —
• W83176R-401
  Winbond Electronic —
• W83176R-705
  Winbond Electronic —