Результаты поиска 36274

Найдено 31 результатов.

• 13627448
  Delphi Connection Systems — Delphi Connection Systems 13627448 Terminal Type: Wire Connector
• 536274-1
  TE Connectivity — TE Connectivity 536274-1 Bus Bar Material: Phosphor Bronze Bus Bar Mating Area Plating: Gold (30) Bus Bar Termination Area Plating: Tin-Lead with Nickel underplated Connector Style: Plug Flame Retardant: Yes Guides: Without Housing Material: High Temperature Thermoplastic Lead Free Solder Processes: Not relevant for lead free process Mount Angle: Vertical Number Of Positions: 40 Pcb Mount Retention: With Pcb Mount Retention Type: Compliant Posts Product Type: Connector Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Signal Contact Material: Phosphor Bronze Signal Contact Mating Area Plating: Gold (30) Signal Contact Termination Area Plating: Tin-Lead with Nickel underplated Stack Height (mm [in]): 10.92 [0.430] Tail Length (mm [in]): 3.68 [0.145] Termination Method To Pc Board: Through Hole - Press Fit
• 536274-3
  TE Connectivity — TE Connectivity 536274-3 Bus Bar Material: Phosphor Bronze Bus Bar Mating Area Plating: Gold (30) Bus Bar Termination Area Plating: Tin-Lead with Nickel underplated Connector Style: Plug Flame Retardant: Yes Guides: Without Housing Material: High Temperature Thermoplastic Lead Free Solder Processes: Not relevant for lead free process Mount Angle: Vertical Number Of Positions: 80 Pcb Mount Retention: With Pcb Mount Retention Type: Compliant Posts Product Type: Connector Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Signal Contact Material: Phosphor Bronze Signal Contact Mating Area Plating: Gold (30) Signal Contact Termination Area Plating: Tin-Lead with Nickel underplated Stack Height (mm [in]): 10.92 [0.430] Tail Length (mm [in]): 3.68 [0.145] Termination Method To Pc Board: Through Hole - Press Fit
• 536274-5
  TE Connectivity — TE Connectivity 536274-5 Bus Bar Material: Phosphor Bronze Bus Bar Mating Area Plating: Gold (30) Bus Bar Termination Area Plating: Tin-Lead with Nickel underplated Connector Style: Plug Flame Retardant: Yes Guides: Without Housing Material: High Temperature Thermoplastic Lead Free Solder Processes: Not relevant for lead free process Mount Angle: Vertical Number Of Positions: 120 Pcb Mount Retention: With Pcb Mount Retention Type: Compliant Posts Product Type: Connector Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Signal Contact Material: Phosphor Bronze Signal Contact Mating Area Plating: Gold (30) Signal Contact Termination Area Plating: Tin-Lead with Nickel underplated Stack Height (mm [in]): 10.92 [0.430], 31.12 [1.225] Tail Length (mm [in]): 3.68 [0.145] Termination Method To Pc Board: Through Hole - Press Fit
• 536274-6
  TE Connectivity — TE Connectivity 536274-6 Bus Bar Material: Phosphor Bronze Bus Bar Mating Area Plating: Gold (30) Bus Bar Termination Area Plating: Tin-Lead with Nickel underplated Connector Style: Plug Flame Retardant: Yes Guides: Without Housing Material: High Temperature Thermoplastic Lead Free Solder Processes: Not relevant for lead free process Mount Angle: Vertical Number Of Positions: 140 Pcb Mount Retention: With Pcb Mount Retention Type: Compliant Posts Product Type: Connector Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Signal Contact Material: Phosphor Bronze Signal Contact Mating Area Plating: Gold (30) Signal Contact Termination Area Plating: Tin-Lead with Nickel underplated Stack Height (mm [in]): 10.92 [0.430] Tail Length (mm [in]): 3.68 [0.145] Termination Method To Pc Board: Through Hole - Press Fit
• 536274-7
  TE Connectivity — TE Connectivity 536274-7 Bus Bar Material: Phosphor Bronze Bus Bar Mating Area Plating: Gold (30) Bus Bar Termination Area Plating: Tin-Lead with Nickel underplated Connector Style: Plug Flame Retardant: Yes Guides: Without Housing Material: High Temperature Thermoplastic Lead Free Solder Processes: Not relevant for lead free process Mount Angle: Vertical Number Of Positions: 160 Pcb Mount Retention: With Pcb Mount Retention Type: Compliant Posts Product Type: Connector Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Signal Contact Material: Phosphor Bronze Signal Contact Mating Area Plating: Gold (30) Signal Contact Termination Area Plating: Tin-Lead with Nickel underplated Stack Height (mm [in]): 10.92 [0.430] Tail Length (mm [in]): 3.68 [0.145] Termination Method To Pc Board: Through Hole - Press Fit
• DR336-274
  Datatronic Distribution —
• 5536274-3
  TE Connectivity — TE Connectivity 5536274-3 Bus Bar Material: Phosphor Bronze Bus Bar Mating Area Plating: Gold (30) Bus Bar Termination Area Plating: Matte Tin with Nickel underplated Connector Style: Plug Flame Retardant: Yes Guides: Without Housing Material: High Temperature Thermoplastic Lead Free Solder Processes: Not relevant for lead free process Mount Angle: Vertical Number Of Positions: 80 Pcb Mount Retention: With Pcb Mount Retention Type: Compliant Posts Product Type: Connector Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Signal Contact Material: Phosphor Bronze Signal Contact Mating Area Plating: Gold (30) Signal Contact Termination Area Plating: Matte Tin with Nickel underplated Stack Height (mm [in]): 10.92 [0.430] Tail Length (mm [in]): 3.68 [0.145] Termination Method To Pc Board: Through Hole - Press Fit
• 2222336274
  VISHAY [Vishay Siliconix] — Interference Suppression Film Capacitors MKP Radial Potted Type
• BFC2336274
  VISHAY [Vishay Siliconix] — Interference Suppression Film Capacitors MKP Radial Potted Type