Результаты поиска 14025

Найдено 168 результатов.

• RU8-140-25-DP-H-DV
  Samtec — Samtec RU8-140-25-DP-H-DV Body Orientation: Straight Card Thickness (mm): 1.6mm Contact Material: Beryllium Copper Contact Plating: Gold Over Nickel Current Rating (max): 3.1A Housing Color: Black Housing Material: Liquid Cryst Polymer Mounting Style: Surface Mount Number Of Contact Rows: 2 Number Of Contacts: 80POS Operating Temp Range: -55C to 125C Pitch (mm): 0.8mm Product Height (mm): 25mm Termination Method: Solder Type: Riser Card Kit
• RU8-140-25-SE-SM-DV
  Samtec — Samtec RU8-140-25-SE-SM-DV Body Orientation: Straight Card Thickness (mm): 1.6mm Contact Material: Beryllium Copper Contact Plating: Gold Over Nickel Current Rating (max): 3.1A Housing Color: Black Housing Material: Liquid Cryst Polymer Mounting Style: Surface Mount Number Of Contact Rows: 2 Number Of Contacts: 80POS Operating Temp Range: -55C to 125C Pitch (mm): 0.8mm Product Height (mm): 25mm Termination Method: Solder Type: Riser Card Kit
• RU8-140-25-DP-SM-DV
  Samtec — Samtec RU8-140-25-DP-SM-DV Body Orientation: Straight Card Thickness (mm): 1.6mm Contact Material: Beryllium Copper Contact Plating: Gold Over Nickel Current Rating (max): 3.1A Housing Color: Black Housing Material: Liquid Cryst Polymer Mounting Style: Surface Mount Number Of Contact Rows: 2 Number Of Contacts: 80POS Operating Temp Range: -55C to 125C Pitch (mm): 0.8mm Product Height (mm): 25mm Termination Method: Solder Type: Riser Card Kit
• UPL1-1REC4-1402-500
  Sensata Technologies/Airpax — CIRCUIT BREAKER MAG-HYDR LEVER
• UPL1-1REC4-1402-510
  Sensata Technologies/Airpax — CIRCUIT BREAKER MAG-HYDR LEVER
• RU8-140-25-SE-S-DV-K
  Samtec — Samtec RU8-140-25-SE-S-DV-K Body Orientation: Straight Card Thickness (mm): 1.6mm Contact Material: Beryllium Copper Contact Plating: Gold Over Nickel Current Rating (max): 3.1A Housing Color: Black Housing Material: Liquid Cryst Polymer Mounting Style: Surface Mount Number Of Contact Rows: 2 Number Of Contacts: 80POS Operating Temp Range: -55C to 125C Pitch (mm): 0.8mm Product Height (mm): 25mm Termination Method: Solder Type: Riser Card Kit
• RU8-140-25-DP-S-DV-K
  Samtec — Samtec RU8-140-25-DP-S-DV-K Body Orientation: Straight Card Thickness (mm): 1.6mm Contact Material: Beryllium Copper Contact Plating: Gold Over Nickel Current Rating (max): 3.1A Housing Color: Black Housing Material: Liquid Cryst Polymer Mounting Style: Surface Mount Number Of Contact Rows: 2 Number Of Contacts: 80POS Operating Temp Range: -55C to 125C Pitch (mm): 0.8mm Product Height (mm): 25mm Termination Method: Solder Type: Riser Card Kit
• RU8-140-25-DP-H-DV-K
  Samtec — Samtec RU8-140-25-DP-H-DV-K Body Orientation: Straight Card Thickness (mm): 1.6mm Contact Material: Beryllium Copper Contact Plating: Gold Over Nickel Current Rating (max): 3.1A Housing Color: Black Housing Material: Liquid Cryst Polymer Mounting Style: Surface Mount Number Of Contact Rows: 2 Number Of Contacts: 80POS Operating Temp Range: -55C to 125C Pitch (mm): 0.8mm Product Height (mm): 25mm Termination Method: Solder Type: Riser Card Kit
• 451-40-256-00-003000
  Mill-Max Mfg — Mill-Max Mfg. 451-40-256-00-003000 Mfr Package Description: ROHS COMPLIANT Lead Free: Yes EU RoHS Compliant: Yes Contact Material: NOT SPECIFIED Device Socket Type: IC SOCKET Number of Contacts: 56 Device Type Used On: DIP56 Manufacturer Series: 451 Contact Finish - Mating: MATTE TIN (200) OVER NICKEL (150) Contact Finish - Termination: MATTE TIN (200) OVER NICKEL (150)
• 850-80-011-40-251191
  Preci-Dip — CONN HDR 11POS 1.27MM SMD R/A