TI (Texas Instruments) AM3358ZCZD50 Mfr Package Description: 0.80 MM PITCH, LEAD FREE, PLASTIC, BGA-324 Technology: CMOS Package Shape: SQUARE Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH Surface Mount: Yes Terminal Form: BALL Terminal Pitch: 0.8000 mm Terminal Position: BOTTOM Number of Functions: 1 Number of Terminals: 324 Package Body Material: PLASTIC/EPOXY Supply Voltage-Max (Vsup): 1.15 V Supply Voltage-Min (Vsup): 1.06 V Supply Voltage-Nom (Vsup): 1.1 V Address Bus Width: 0.0 Bit Size: 32 Boundary Scan: Yes Clock Freq-Max (fclk): 26 MHz External Data Bus Width: 16 Integrated Cache: Yes Low Power Mode: Yes Microprocess IC Type: RISC PROCESSOR Speed: 500 MHz