63253-1 datasheet

Маркировка

63253-1
Производитель

TE Connectivity
Описание

TE Connectivity 63253-1 Cavity Size: Size 2 Lead Free Solder Processes: Wave solder capable to 240?°C, Wave solder capable to 260?°C, Wave solder capable to 265?°C, Reflow solder capable to 245?°C, Reflow solder capable to 260?°C, Pin-in-Paste capable to 245?°C, Pin-in-Paste capable to 260?°C Magnet Wire Range (mm [awg]): 0.18 ?€“ 0.265 [31 ?€“ 33] Packaging Method: Strip Plating Material: Tin over Copper Product Type: Terminal Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Series: 300 Box Specials: Solder Stock Thickness (mm [in]): 0.25 [0.010] Terminal Configuration: Posted Terminal Height (mm [in]): 7.62 [0.300] Terminal Line: Standard MAG-MATE Termination Method To Wire/cable: IDC Standard
Количество страниц

1 шт.
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89,51 KB