TE Connectivity 533287-4 Body Orientation: Straight Center Guide: Without Centerline (mm [in]): 2.54 [0.100] Contact Base Material: Beryllium Copper Contact Configuration: Four-Beam Contact Material: Beryllium Copper Contact Plating: Gold Contact Plating, Mating Area, Material: Gold (30) Gender: F Government/industry Qualification: No Housing Color: Brown Housing Material: Polyphenylene Sulfid Housing Material Temperature: High Lead Free Solder Processes: Wave solder capable to 240?°C, Wave solder capable to 260?°C, Wave solder capable to 265?°C, Reflow solder capable to 245?°C, Reflow solder capable to 260?°C, Pin-in-Paste capable to 245?°C, Pin-in-Paste capable to 260?°C Lead Free Status / Rohs Status: No Make First / Break Last: No Mating Alignment: Without Mounting Style: Through Hole Number Of Contact Rows: 3 Number Of Contacts: 105POS Number Of Positions: 105 Number Of Rows: 3 Pcb Mount Retention: Without Pcb Mount Style: Through Hole Pcb Mounting Orientation: Vertical Pitch (mm): 2.54mm Product Type: Connector Rohs Compliant: NO Rohs/elv Compliance: Not ELV/RoHS compliant Solder Tail Contact Plating: Tin-Lead Termination Method: Solder Termination Post Length (mm [in]): 3.78 [0.149] Type: HDI Underplate Material: Nickel Number of Rows: 3 Number of Positions / Contacts: 105 Mounting Angle: Vertical Pitch: 2.54 mm Termination Style: Solder