TE Connectivity 2134441-2 Applies To: Printed Circuit Board Assembly Process Feature: Without Pick and Place Cover Contact Plating, Mating Area, Material: Gold Contact Termination Type: Surface Mount Gender: Receptacle Housing Color: Black Industry Standard: USB 2.0 Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Led: Without Locking Feature: Without Mount Location: Mid Mount Number Of Ports: 1 Orientation: Right Angle Packaging Method: Tape & Reel Panel Ground: Without Pcb Mount Retention Type: SMT Hold Down Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Series: B Size: Micro