TE Connectivity 1339394-1 Accepts Wire Insulation Diameter, Range (mm [in]): 0.76 ?€“ 1.02 [0.030 ?€“ 0.040] Application: Wire-to-Board Applies To: Wire/Cable, Printed Circuit Board Housing Material: Polyester Lead Free Solder Processes: Wave solder capable to 240?°C, Wave solder capable to 260?°C, Wave solder capable to 265?°C Mount: Printed Circuit Board Number Of Pairs: 1 Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Solder Tail Contact Material: Copper Alloy Solder Tail Contact Plating: Tin over Nickel Stuffer Label: None Termination Method: Solder, IDC Termination Post Length (mm [in]): 2.67 [0.105] Wire Entry Location: Front or Back Wire Size (mm?? [awg]): 0.12-0.4?? [26-22] Wire Stuffer Cap Color: Tan