1-2040374-2 datasheet

Маркировка

1-2040374-2
Производитель

TE Connectivity
Описание

TE Connectivity 1-2040374-2 Application: Production Assembly Process Feature: Pick and Place Cover, Plastic CAP Chip Compatibility: 722 PGA Devices with 1.219 x 1.219 Contact Pattern Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (25) Contact Style: Stamped + Formed Frame Style: Closed Grid Size: 35x35 Grid Spacing (mm [in]): 1.219 x 1.219 [.0479 x .0479] Heat Sink Attachment: Without Housing Color: Black Housing Material: Thermoplastic - GF Insertion Force: ZIF Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Number Of Positions: 722 Packaging Method: Tape Mounted on Reel Pcb Mount Style: Surface Mount Profile: Standard Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Socket Identifier: FS1, Socket 722 Zif Actuator: Single Lever
Количество страниц

4 шт.
Формат

PDF
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Размер файла

1,26 MB