Microchip Technology 28C64B-90I/K Mfr Package Description: CERAMIC, LCC-32 Technology: CMOS Package Shape: RECTANGULAR Package Style: CHIP CARRIER Surface Mount: Yes Terminal Form: NO LEAD Terminal Pitch: 1.27 mm Terminal Finish: TIN LEAD Terminal Position: QUAD Number of Functions: 1 Number of Terminals: 32 Package Body Material: CERAMIC, METAL-SEALED COFIRED Temperature Grade: INDUSTRIAL Memory Width: 8 Organization: 8K X 8 Memory Density: 65536 deg Operating Mode: ASYNCHRONOUS Number of Words: 8192 words Number of Words Code: 8K Operating Temperature-Max: 85 Cel Operating Temperature-Min: -40 Cel Supply Voltage-Max (Vsup): 5.5 V Supply Voltage-Min (Vsup): 4.5 V Supply Voltage-Nom (Vsup): 5 V Memory IC Type: EEPROM 5V Parallel/Serial: PARALLEL Access Time-Max (tACC): 90 ns