Intersil CD40175BDMSR Mfr Package Description: SIDE BRAZED, CERAMIC, DIP-16 Technology: CMOS Package Shape: RECTANGULAR Package Style: IN-LINE Terminal Form: THROUGH-HOLE Terminal Pitch: 2.54 mm Terminal Finish: TIN LEAD Terminal Position: DUAL Number of Functions: 1 Number of Terminals: 16 Package Body Material: CERAMIC, METAL-SEALED COFIRED Temperature Grade: MILITARY Operating Temperature-Max: 125 Cel Operating Temperature-Min: -55 Cel Supply Voltage-Max (Vsup): 18 V Supply Voltage-Min (Vsup): 3 V Supply Voltage-Nom (Vsup): 5 V Logic IC Type: D FLIP-FLOP Number of Bits: 4 Output Polarity: COMPLEMENTARY Propagation Delay (tpd): 540 ns Trigger Type: POSITIVE EDGE fmax-Min: 1.48 MHz