Cypress Semiconductor CY7B210-25HI Mfr Package Description: WINDOWED, HERMETIC SEALED, CERAMIC, LCC-44 Technology: BICMOS Package Shape: SQUARE Package Style: CHIP CARRIER Surface Mount: Yes Terminal Form: J BEND Terminal Finish: TIN LEAD Terminal Position: QUAD Number of Functions: 1 Number of Terminals: 44 Package Body Material: CERAMIC, METAL-SEALED COFIRED Temperature Grade: INDUSTRIAL Memory Width: 16 Organization: 64K X 16 Memory Density: 1.05E6 deg Operating Mode: ASYNCHRONOUS Number of Words: 65536 words Number of Words Code: 64K Operating Temperature-Max: 85 Cel Operating Temperature-Min: -40 Cel Supply Voltage-Max (Vsup): 5.5 V Supply Voltage-Min (Vsup): 4.5 V Supply Voltage-Nom (Vsup): 5 V Memory IC Type: UVPROM Parallel/Serial: PARALLEL Access Time-Max (tACC): 25 ns