AMD (Advanced Micro Devices) AM29SL400CB-150WBC Mfr Package Description: 6 X 8 MM, 0.80 MM PITCH, FBGA-48 Technology: CMOS Package Shape: RECTANGULAR Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH Surface Mount: Yes Terminal Form: BALL Terminal Pitch: 0.8000 mm Terminal Position: BOTTOM Number of Functions: 1 Number of Terminals: 48 Package Body Material: PLASTIC/EPOXY Temperature Grade: COMMERCIAL Memory Width: 16 Organization: 256K X 16 Memory Density: 4.19E6 deg Operating Mode: ASYNCHRONOUS Number of Words: 262144 words Number of Words Code: 256K Alternate Memory Width: 8 Operating Temperature-Max: 70 Cel Operating Temperature-Min: 0.0 Cel Supply Voltage-Max (Vsup): 2.2 V Supply Voltage-Min (Vsup): 1.65 V Supply Voltage-Nom (Vsup): 1.8 V Memory IC Type: FLASH 1.8V PROM Parallel/Serial: PARALLEL Access Time-Max (tACC): 150 ns