AMD (Advanced Micro Devices) AM27S190A/BJA Mfr Package Description: HERMETIC SEALED, CERAMIC, DIP-24 Technology: BIPOLAR Package Shape: RECTANGULAR Package Style: IN-LINE Terminal Form: THROUGH-HOLE Terminal Pitch: 2.54 mm Terminal Finish: TIN LEAD Terminal Position: DUAL Number of Functions: 1 Number of Terminals: 24 Package Body Material: CERAMIC, GLASS-SEALED Temperature Grade: MILITARY Memory Width: 8 Organization: 2K X 8 Memory Density: 16384 deg Operating Mode: ASYNCHRONOUS Number of Words: 2048 words Number of Words Code: 2K Operating Temperature-Max: 125 Cel Operating Temperature-Min: -55 Cel Supply Voltage-Max (Vsup): 5.5 V Supply Voltage-Min (Vsup): 4.5 V Supply Voltage-Nom (Vsup): 5 V Memory IC Type: OTPROM Parallel/Serial: PARALLEL Access Time-Max (tACC): 50 ns