Результаты поиска MS27467T11B35AB
Найдено 2 результатов.
- AMD (Advanced Micro Devices) — AMD (Advanced Micro Devices) AMZ8073ALCB Mfr Package Description: CERAMIC, LCC-44 Technology: MOS Package Shape: SQUARE Package Style: CHIP CARRIER Surface Mount: Yes Terminal Form: NO LEAD Terminal Pitch: 1.27 mm Terminal Position: QUAD Number of Functions: 1 Number of Terminals: 44 Package Body Material: CERAMIC, METAL-SEALED COFIRED Temperature Grade: COMMERCIAL Operating Temperature-Max: 70 Cel Operating Temperature-Min: 0.0 Cel Supply Voltage-Max (Vsup): 5.25 V Supply Voltage-Min (Vsup): 4.75 V Supply Voltage-Nom (Vsup): 5 V External Data Bus Width: 16 Information Access Method: PARALLEL, DIRECT ADDRESS Microprocess IC Type: PROGRAMMABLE TIMER Number of Timers: 5
- TE Connectivity Deutsch Connectors — CONN HSG PLUG STRGHT 13POS PIN