Результаты поиска MCP618-I/MS
Найдено 2 результатов.
- Microchip — Amplifiers - Operational Single 2.3V PNP in
- SPANSION — SPANSION AM29LV160DT70WCK Mfr Package Description: 8 X 9 MM, 0.80 MM PITCH, FBGA-48 Technology: CMOS Package Shape: RECTANGULAR Package Style: GRID ARRAY Surface Mount: Yes Terminal Form: BALL Terminal Pitch: 0.8000 mm Terminal Finish: TIN SILVER COPPER Terminal Position: BOTTOM Number of Functions: 1 Number of Terminals: 48 Package Body Material: PLASTIC/EPOXY Temperature Grade: MILITARY Memory Width: 16 Organization: 1M X 16 Memory Density: 1.68E7 deg Operating Mode: ASYNCHRONOUS Number of Words: 1.05E6 words Number of Words Code: 1M Alternate Memory Width: 8 Operating Temperature-Max: 125 Cel Operating Temperature-Min: -55 Cel Supply Voltage-Max (Vsup): 3.6 V Supply Voltage-Min (Vsup): 2.7 V Supply Voltage-Nom (Vsup): 3 V Memory IC Type: FLASH 3V PROM Parallel/Serial: PARALLEL Access Time-Max (tACC): 70 ns