Результаты поиска DILB14P-223TLF
Найдено 2 результатов.
- FCI Semiconductor — FCI Semiconductor DILB14P-223TLF Contact Material: Copper Alloy Contact Plating: Tin over Nickel Features: Standard Lead Free Status / Rohs Status: Lead free / RoHS Compliant Mounting Style: Through Hole Number Of Positions / Contacts: 14 Number Of Rows: 2 Pitch: 2.54 mm Product: DIP / SIP Sockets Row Spacing: 7.62 mm Socket / Case Type: Open Frame Termination Style: Solder Pin
- FCI Semiconductor — FCI Semiconductor DILB14P-223TLF Contact Material: Copper Alloy Contact Plating: Tin over Nickel Features: Standard Lead Free Status / Rohs Status: Lead free / RoHS Compliant Mounting Style: Through Hole Number Of Positions / Contacts: 14 Number Of Rows: 2 Pitch: 2.54 mm Product: DIP / SIP Sockets Row Spacing: 7.62 mm Socket / Case Type: Open Frame Termination Style: Solder Pin