Результаты поиска BDN10-3CB/A01

Найдено 3 результатов.

• BDN103CBA01
  CTS Electronic Components — CTS Electronic Components BDN103CBA01 Product Category: Heat Sinks RoHS: yes Product: Heat Sinks Mounting Style: Adhesive Heatsink Material: Aluminum Fin Style: Vertical Thermal Resistance: 26.4 C/W Length: 25.65 mm Width: 25.65 mm Height: 9.02 mm Designed for: BGA, PGA, PLCC, QFP Color: Black Factory Pack Quantity: 1
• BDN10-3CB/A01
  CTS Corporation — CTS Corporation BDN10-3CB/A01 Attachment Method: Thermal Tape, Adhesive (Included) Height: 0.35" (9mm) Outline: 25.65mm x 25.65mm Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Power Dissipation @ Temperature Rise: - Series: BDN Thermal Resistance @ Forced Air Flow: 8.0В°C/W @ 400 LFM Thermal Resistance @ Natural: 26.4В°C/W Other Names: 294-1098
• BDN10-3CB/A01
  CTS Corporation — CTS Corporation BDN10-3CB/A01 Attachment Method: Thermal Tape, Adhesive (Included) Height: 0.35" (9mm) Outline: 25.65mm x 25.65mm Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Power Dissipation @ Temperature Rise: - Series: BDN Thermal Resistance @ Forced Air Flow: 8.0В°C/W @ 400 LFM Thermal Resistance @ Natural: 26.4В°C/W Other Names: 294-1098