Результаты поиска 2132720-1
Найдено 1 результатов.
- TE Connectivity — TE Connectivity 2132720-1 Application Use: Board-to-Board Applies To: Printed Circuit Board Board-to-board Configuration: Orthogonal Centerline (mm [in]): 2.15 [0.0846] Connector Style: Receptacle Connector Type: Connector Assembly Contact - Rated Current (a): 0.75 Contact Base Material: Copper-Nickel-Silicon Contact Design: Dual Beam Contact Plating, Mating Area, Material: Gold Contact Plating, Mating Area, Thickness (Вµm [Ојin]): 0.762 [30] Contact Transmits (typical Application): Signal (Data) Contact Type: Socket Csa Certified: Yes Differential Signaling: With Hot Pluggable: No Housing Color: Black Housing Material: Liquid Crystal Polymer (LCP) Industry Application: Networking (Communications) Lead Free Solder Processes: Not relevant for lead free process Length (x-axis) (mm [in]): 20.25 [0.7972] Make First / Break Last: No Mating Alignment: With Mating Retention: Without Number Of Columns: 10 Number Of Positions: 180 Number Of Rows: 18 Operating Voltage (vac): 120 Operating Voltage (vdc): 120 Operating Voltage Reference: AC/DC Packaging Method: Tube Pcb Mount Alignment Type: NONE Pcb Mount Retention: Without Pcb Mount Retention Type: None Pcb Mounting Orientation: Right Angle Product Line: IMPACT Product Type: Connector Profile Height (y-axis) (mm [in]): 25.40 [1.000] Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Tail Length (mm [in]): 1.2 [0.047] Tail Orientation: In-line Tail Plating Material: Matte Tin Tail Plating, Thickness (Вµm [Ојin]): 1.27 [50] Termination Method To Pc Board: Through Hole - Press Fit Ul File Number: E28476 Ul Flammability Rating: UL 94V-0 Ul Rating: Recognized Underplate Material: Nickel Underplate Material Thickness (Вµm [Ојin]): 1.27 [50.000] Width (z-axis) (mm [in]): 37.30 [1.469]