Результаты поиска 15.931
Найдено 70 результатов.
- Mii (Micropac Industries, Inc.) —
- Mii (Micropac Industries, Inc.) —
- TE Connectivity — TE Connectivity 1411593-1 Contact Base Material: Copper Alloy Contact Configuration: Receptacle Contact Plating, Mating Area, Material: Tin Lead Free Solder Processes: Not relevant for lead free process Mount: Wire Crimp Packaging Method: Reel Product Type: Contact Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Wire Range (mm [awg]): 0.75-1.00ВІ [18-17]
- Sanyo Semiconductor —
- PRECI-DIP —
- ON Semiconductor —
- MOLEX —
- Molex, LLC — Connector Barrier Block Strip 31 Circuit 0.325" (8.26mm)
- 3M — EXL DEBURRING WHEEL 8" 8A MED
- Vishay Intertechnology — Vishay Intertechnology 238159313507 Ac Voltage Rating (max): 35VAC Capacitance Value: 1300pF Clamping Current: 2.5A Clamping Voltage: 115V Dc Voltage Rating (max): 45VDC Lead Spacing: 5mm Lead Style: Radial Mounting: Through Hole Operating Temp Range: -40C to 85C Product Depth (mm): 4.8mm Product Diameter (mm): 9mm Product Height (mm): 13mm Surge Current (max): 250A Technology: Zinc Oxide Varistor Voltage: 56V