Результаты поиска 13287

Найдено 26 результатов.

• 13287
  AIM — Wire Solder SN60/Pb40 RA 3% .025 DIA 1 lb.
• 513-287
  SloanLED — LED, T1-3/4, WEDGE BASE, 28 VOLT, WHITE
• 2313287
  Phoenix Contact — Phoenix Contact 2313287 Accessory Type: Programming Device Connector Features: - Number Of Positions: 9 Series: SUBCON Other Names: Q5613617
• 1013287
  Phoenix Contact — Phoenix Contact 1013287 Color: Transparent Lead Free Status / Rohs Status: Lead free / RoHS Compliant Product: Component Marker
• HB13287
  ETC1 [List of Unclassifed Manufacturers] — Breake Away Header .025(0.64mm) Square Posts
• HC13287
  ETC1 [List of Unclassifed Manufacturers] — Breake Away Header .025(0.64mm) Square Posts
• SPC13287
  Multicomp — Multicomp SPC13287 Approval Categories: NEMA 5-15P Cable Assembly Type: Power Cord Cable Color: Black Cable Length: 6.6ft Conductor Size Awg: 18 Connector Type A: NEMA 5-15P Connector Type B: IEC320-C13 Current Rating: 10A Jacket Color: Black Rohs Compliant: Yes Voltage Rating: 125V Wire Size (awg): 18
• 2013287-1
  TE Connectivity — Tyco Electronics 2013287-1 Connector Style: DIMM Contact Finish: Gold Contact Finish Thickness: Flash Features: Board Guide, Latches Lead Free Status / Rohs Status: Lead free / RoHS Compliant Memory Type: DDR 3 SDRAM Mounting Feature: Reverse Mounting Type: Surface Mount, 25В° Angle Number Of Positions: 204 Product Type: SODIMM Series: - Standards: -
• 2013287-2
  TE Connectivity — TE Connectivity 2013287-2 Application Type: DDR 3 SO-DIMM Boss: With Center Key (mm [in]): Offset Right Centerline (mm [in]): 0.60 [0.024] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (6) Dram Type: Double Data Rate (DDR) III Dram Voltage: 1.5 V Ejector Location: Both Ends Ejector Type: Locking Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Style: Cam-In Keying: Reverse Latch Material: Stainless Steel Latch Plating: Tin Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Module Orientation: Right Angle Number Of Keys: 1 Number Of Positions: 204 Number Of Rows: Dual Packaging Method: Semi-Hard Tray Assembly Pcb Mount Style: Surface Mount Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 8.20 [0.322] Socket Style: SO DIMM Socket Type: Memory Card Stack Height (mm [in]): 4.00 [0.157]
• 2013287-3
  TE Connectivity — TE Connectivity 2013287-3 Application Type: DDR 3 SO-DIMM Boss: With Center Key (mm [in]): Offset Right Centerline (mm [in]): 0.60 [0.024] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (30) Dram Type: Double Data Rate (DDR) III Dram Voltage: 1.5 V Ejector Location: Both Ends Ejector Type: Locking Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Style: Cam-In Keying: Reverse Latch Material: Stainless Steel Latch Plating: Tin Lead Free Solder Processes: Reflow solder capable to 245В°C, Reflow solder capable to 260В°C Module Orientation: Right Angle Number Of Keys: 1 Number Of Positions: 204 Number Of Rows: Dual Packaging Method: Semi-Hard Tray Assembly Pcb Mount Style: Surface Mount Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 8.20 [0.322] Socket Style: SO DIMM Socket Type: Memory Card Stack Height (mm [in]): 4.00 [0.157]